Which of the following is most difficult to fabricate in an IC?
A. Diode
B. Transistor
C. FET
D. Capacitor
Answer: Option D
Solution (By Examveda Team)
This question is about making parts for computer chips (Integrated Circuits or ICs). Think of it like building with LEGOs, but the LEGOs are tiny electrical components.We have four choices: diodes, transistors, FETs (a special type of transistor), and capacitors.
Diodes are relatively simple to make.
Transistors are a bit more complex than diodes, but still manageable in IC fabrication.
FETs are a type of transistor, so they have similar complexity.
Capacitors, however, are the trickiest to make small and efficiently on a chip. They need a specific structure to store electrical charge, and achieving the desired capacitance value in a tiny area is challenging. This makes them the most difficult to fabricate.
Therefore, the answer is D: Capacitor.
This Question Belongs to Electrical Engineering >> Integrated Circuits
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Which of the following is most difficult to fabricate in an IC?
A. Diode
B. Transistor
C. FET
D. Capacitor
___________ cannot be fabricated on an IC
A. Transistors
B. Diodes
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Capacitors are one of the most fabricated components in ICs (Integrated Circuits) due to several reasons:
*Reasons for high fabrication of capacitors in ICs*
1. *Decoupling and Filtering*: Capacitors are used to decouple and filter signals, reducing noise and interference in the circuit.
2. *Energy Storage*: Capacitors store energy, which is essential for many IC functions, such as voltage regulation, signal processing, and memory storage.
3. *Frequency Selection*: Capacitors are used in resonant circuits to select specific frequencies, which is crucial for many IC applications, such as radio frequency (RF) circuits and oscillators.
4. *Impedance Matching*: Capacitors are used to match impedance between different circuit stages, ensuring maximum power transfer and minimizing signal loss.
5. *Small Size and Low Cost*: Capacitors are relatively small and inexpensive to fabricate, making them a cost-effective solution for many IC applications.
*Types of capacitors fabricated in ICs*
1. *MOS Capacitors*: Metal-Oxide-Semiconductor (MOS) capacitors are widely used in ICs due to their high capacitance density and low leakage current.
2. *Poly Capacitors*: Polysilicon capacitors are used in ICs for their high capacitance density and good matching characteristics.
3. *MIM Capacitors*: Metal-Insulator-Metal (MIM) capacitors are used in ICs for their high capacitance density, low leakage current, and good matching characteristics.
*Challenges in fabricating capacitors in ICs*
1. *Matching and Variability*: Capacitor matching and variability can be challenging, especially in high-frequency applications.
2. *Leakage Current*: Capacitor leakage current can be a concern, especially in low-power applications.
3. *Area Efficiency*: Capacitors can occupy significant area on the IC, making area efficiency a challenge.
Despite these challenges, capacitors remain a crucial component in IC design, and researchers continue to explore new materials, structures, and fabrication techniques to improve their performance and area efficiency.
Y capacitor is the most fabricated one in IC