Why is silicon dioxide (SiO2) layer used in ICs?
A. To protect the surface of the chip from external contaminants and to allow for selective formation of the n and p regions by diffusion
B. because it facilitates the penetration of the desired impurity by diffusion
C. To control the concentration of the diffused impurities by diffusion
D. Because of its high heat conduction
Answer: Option A
This Question Belongs to Electronics And Communications Engineering >> Electronic Devices And Circuits
The forbidden energy gap between the valence band and conduction band will be least in case of
A. Metals
B. Semiconductors
C. Insulators
D. All of the above
For a NPN bipolar transistor, what is the main stream of current in the base region?
A. Drift of holes
B. Diffusion of holes
C. Drift of electrons
D. Diffusion of electrons
A. Both A and R are true and R is correct explanation of A
B. Both A and R are true but R is not a correct explanation of A
C. A is true but R is false
D. A is false but R is true
For a P-N diode, the number of minority carriers crossing the junction depends on
A. Forward bias voltage
B. Potential barrier
C. Rate of thermal generation of electron hole pairs
D. None of the above
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