Interconnection pattern is made on . . . . . . . .
A. Polysilicon layer
B. Silicon-di-oxide layer
C. Metal layer
D. Diffusion layer
Answer: Option C
A. Polysilicon layer
B. Silicon-di-oxide layer
C. Metal layer
D. Diffusion layer
Answer: Option C
The dopants are introduced in the active areas of silicon by using which process?
A. Diffusion process
B. Ion Implantation process
C. Chemical Vapour Deposition
D. Either Diffusion or Ion Implantation Process
What are the advantages of E-beam masks?
A. Small feature size
B. Larger feature size
C. Looser layer
D. Complex design
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