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VLSI Design And Testing MCQ Questions & Answers | ECE

Learn VLSI Design And Testing MCQ questions & answers are available for a Electronics and Communications Engineering(ECE) students to clear GATE exams, various technical interview, competitive examination, and another entrance exam. VLSI Design And Testing MCQ question is the important chapter for a Electronics and Communications Engineering(ECE) and GATE students.

Each section contains 100 MCQs on VLSI Design and Testing .
1
Contact cuts are made in . . . . . . . . .
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Answer & Solution
Answer: Option A
No explanation is given for this question. Let's Discuss on Board
2
The dopants are introduced in the active areas of silicon by using which process?
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Answer & Solution
Answer: Option D
No explanation is given for this question. Let's Discuss on Board
3
Which is used for the interconnection?
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Answer & Solution
Answer: Option C
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4
What are the advantages of E-beam masks?
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Answer & Solution
Answer: Option A
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5
In nMOS fabrication, etching is done using . . . . . . . . .
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Answer & Solution
Answer: Option A
No explanation is given for this question. Let's Discuss on Board
6
Depletion mode MOSFETs are more commonly used as . . . . . . . .
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Answer & Solution
Answer: Option B
No explanation is given for this question. Let's Discuss on Board
7
Increasing Vsb . . . . . . . . the threshold voltage.
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Answer & Solution
Answer: Option C
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8
Which process produces a circuit which is less prone to latch-up effect?
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Answer & Solution
Answer: Option D
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9
Positive photo resists are used more than negative photo resists because . . . . . . . .
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Answer & Solution
Answer: Option A
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10
N-well is formed by . . . . . . . .
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Answer & Solution
Answer: Option B
No explanation is given for this question. Let's Discuss on Board