nMOS fabrication process is carried out in . . . . . . . .
A. Thin wafer of a single crystal
B. Thin wafer of multiple crystals
C. Thick wafer of a single crystal
D. Thick wafer of multiple crystals
Answer: Option A
Related Questions on VLSI Design and Testing
The dopants are introduced in the active areas of silicon by using which process?
A. Diffusion process
B. Ion Implantation process
C. Chemical Vapour Deposition
D. Either Diffusion or Ion Implantation Process
What are the advantages of E-beam masks?
A. Small feature size
B. Larger feature size
C. Looser layer
D. Complex design
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