The collector contact region is doped with higher concentration of n-type impurities due to . . . . . . . .
A. It creates a depletion region at the contact surface
B. It creates a low conductivity path between collector region and contact
C. It reduces contact resistance
D. It can withstand high voltages as compared to collector region
Answer: Option C
Related Questions on VLSI Design and Testing
The dopants are introduced in the active areas of silicon by using which process?
A. Diffusion process
B. Ion Implantation process
C. Chemical Vapour Deposition
D. Either Diffusion or Ion Implantation Process
What are the advantages of E-beam masks?
A. Small feature size
B. Larger feature size
C. Looser layer
D. Complex design
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