A. Decreasing the width
B. Increasing the width
C. Increasing the length
D. Decreasing the length
Answer: Option B
This Question Belongs to Electronics And Communications Engineering >> VLSI Design And Testing
The dopants are introduced in the active areas of silicon by using which process?
A. Diffusion process
B. Ion Implantation process
C. Chemical Vapour Deposition
D. Either Diffusion or Ion Implantation Process
What are the advantages of E-beam masks?
A. Small feature size
B. Larger feature size
C. Looser layer
D. Complex design
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